Sunday, July 17, 2011
Apple iPhone 5's A6 processor to feature TSMC's 3D IC technology.......!!!
While we have been hearing about and expecting the first 3D transistors to arrive from Intel, it looks like Apple and its A6 processor might get there first, for the iPhone 5. A report by the Taiwanese EETimes says TSMC is already sampling the 28nm A6 processor for Apple, to determine the yield rates for the new 3D process.
There are reports of the iPhone 5 being delayed due to space and heat issues with the A5 processor (the iPad 2’s CPU) in the smaller form factor. This is considered the biggest reason for accelerating development on the A6 processor, but Apple may also be trying to reduce its reliability on Samsung for the A5 chip. Expected gains from the Apple A6 and the new process is a performance boost of up to 30%, and a reduction in power consumption by nearly 50%, meaning lowered heat output.
Intel’s 3D transistor technology, or Tri-Gate, is expected in 22nm Ivy Bridge processors that are scheduled to arrive by the end of 2011. TSMC’s 3D IC design, the one Apple is reportedly using on the A6 processor, is also said to be less complex, relying on interconnects communicating between die layers, but in a far more effective fashion than previous layering technology seen in the A4 and A5.
TSMC said its commercial 28nm production is scheduled to begin by the end of 2011 as well, so we’ll see who gets there first – Apple or Intel. Samsung's 28nm production should also commence in the same period. In the meanwhile, other rumours speculate that Apple might release an A4-based Apple iPhone 4S in the time it takes TSMC to finish up with the A6, which will be destined for the iPhone 5.
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